The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Dec. 03, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Haijin Wang, Beijing, CN;

Jianfeng Zeng, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 18/2113 (2023.01); G06T 7/00 (2017.01); G06T 7/50 (2017.01); G06V 10/44 (2022.01); G06V 10/762 (2022.01); G06V 10/771 (2022.01); G06V 10/80 (2022.01);
U.S. Cl.
CPC ...
G06T 7/0002 (2013.01); G06T 7/50 (2017.01); G06V 10/7625 (2022.01); G06V 10/80 (2022.01);
Abstract

A computer-implemented method for defect analysis is provided. The computer-implemented method includes obtaining a plurality of sets of defect point coordinates, a respective set of the plurality of sets of detect point coordinates including coordinates of defect points in a respective substrate of a plurality of substrates, the coordinates of defect points in the respective substrate being coordinates in an image coordinate system; combining the plurality of sets of defect point coordinates according to the image coordinate system into a composite set of coordinates to generate a composite image; and performing a clustering analysis to classify defect points in the composite set in the composite image into a plurality of clusters.


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