The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jun. 14, 2021
Applicant:

Waymo Llc, Mountain View, CA (US);

Inventors:

Lucian Ion, Santa Clara, CA (US);

Vlad Constantin Cardei, Redwood City, CA (US);

Carl Warren Craddock, San Francisco, CA (US);

Assignee:

Waymo LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06N 3/02 (2006.01); G06N 3/04 (2006.01); G06N 3/063 (2023.01); G06N 3/067 (2006.01); G06N 3/08 (2006.01); G06V 10/25 (2022.01); G06V 10/764 (2022.01); G06V 10/82 (2022.01); H04N 5/232 (2006.01); H04N 5/341 (2011.01); H04N 23/80 (2023.01); H04N 25/40 (2023.01);
U.S. Cl.
CPC ...
G06N 3/063 (2013.01); G06N 3/02 (2013.01); G06N 3/04 (2013.01); G06N 3/067 (2013.01); G06N 3/0675 (2013.01); G06N 3/08 (2013.01); G06V 10/25 (2022.01); G06V 10/764 (2022.01); G06V 10/82 (2022.01); H01L 27/14605 (2013.01); H01L 27/14609 (2013.01); H01L 27/14634 (2013.01); H04N 23/80 (2023.01); H04N 25/40 (2023.01); H01L 2224/73261 (2013.01);
Abstract

A image sensor includes a first integrated circuit layer including pixel sensors that are grouped based on position into pixel sensor groups, a second integrated circuit layer in electrical communication with the first integrated circuit layer, the second integrated circuit layer including image processing circuitry groups that are configured to each receive pixel information from a corresponding pixel sensor group, the image processing circuitry groups further configured to perform image processing operations on the pixel information to provide processed pixel information during operation of the image sensor, a third integrated circuit layer in electrical communication with the second integrated circuit layer, and the third integrated circuit layer including neural network circuitry groups that are configured to each receive the processed pixel information from a corresponding image processing circuitry group and perform analysis for object detection on the processed pixel information during operation of the image sensor.


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