The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Apr. 07, 2021
Applicant:

Apple Inc., Cupertino, CA (US);

Inventor:

Anne M. Mason, Palo Alto, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G01K 3/00 (2006.01); G01K 7/16 (2006.01); G01L 1/22 (2006.01); G06F 1/18 (2006.01); G06F 1/32 (2019.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); G01K 3/005 (2013.01); G01K 7/16 (2013.01); G01L 1/22 (2013.01); G06F 1/181 (2013.01); G06F 1/32 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/185 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.


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