The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Oct. 18, 2019
Applicant:

Leica Microsystems Cms Gmbh, Wetzlar, DE;

Inventors:

Alexander Weiss, Linden, DE;

Christian Schumann, Lich, DE;

Ronja Capellmann, Wetzlar, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); G02B 21/02 (2006.01); G02B 21/34 (2006.01); G02B 21/00 (2006.01);
U.S. Cl.
CPC ...
G02B 21/34 (2013.01); G01B 11/06 (2013.01); G02B 21/02 (2013.01); G02B 21/0088 (2013.01);
Abstract

A method is useable for determining a thickness of a cover slip or object carrier in a microscope, which has an objective facing toward a sample chamber. Two optical media border two opposing surfaces of the cover slip or object carrier and form two partially reflective interfaces, which are arranged at different distances from the objective. The method includes: deflecting a measurement light beam by the objective with oblique incidence on the cover slip or object carrier; generating two reflection light beams spatially separated from one another by the measurement light beam being partially reflected on each of the two interfaces; receiving the two reflection light beams by the objective and conducting them onto a position-sensitive detector; registering the incidence locations on the position-sensitive detector; and determining the thickness of the cover slip or object carrier based on the registered incidence locations.


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