The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Dec. 16, 2021
58th Research Institute of China Electronics Technology Group Corporation, Jiangsu, CN;
Jinghe Wei, Jiangsu, CN;
Letian Huang, Jiangsu, CN;
Zhiqiang Xiao, Jiangsu, CN;
Mingang Feng, Jiangsu, CN;
Taojie Ding, Jiangsu, CN;
Lihua Zheng, Jiangsu, CN;
Abstract
The invention discloses an interface system for an interconnected die and an MPU and a communication method thereof. The system comprises a data interface, an interrupt interface, and a debugging interface; the data interface comprises an SPI interface, a DDR data interface, and a DMA control interface; the interrupt interface is used for receiving an interrupt data packet from the network and parsing the interrupt data packet to obtain a pulse interrupt input required by the MPU; the debugging interface comprises a JTAG-Core debugging interface, which is used for receiving a debugging data packet from the network and translating the debugging data packet into a JTAG protocol for MPU debugging. The invention realizes the expansion of the master device MPU in the high-performance information processing microsystem and the high-speed communication between the master device and the interconnected dies.