The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Sep. 10, 2019
Applicant:

Facc Ag, Ried im Innkreis, AT;

Inventor:

Helmuth Hoeller, Ried im Innkreis, AT;

Assignee:

FACC AG, Ried im Innkreis, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/42 (2006.01); B29C 33/60 (2006.01); B29C 33/68 (2006.01); B29C 37/00 (2006.01); B29C 70/30 (2006.01); B29C 70/54 (2006.01); B29C 70/68 (2006.01); B32B 3/30 (2006.01); B32B 5/26 (2006.01); B64F 5/60 (2017.01); G01N 25/72 (2006.01); G01N 29/04 (2006.01); G01N 29/30 (2006.01); B29L 31/30 (2006.01); B29L 31/40 (2006.01); G01N 33/00 (2006.01);
U.S. Cl.
CPC ...
G01N 25/72 (2013.01); B29C 37/0067 (2013.01); B29C 37/0075 (2013.01); B29C 70/545 (2013.01); B29C 70/68 (2013.01); B29C 70/682 (2013.01); B29C 70/683 (2013.01); B29C 70/685 (2013.01); B32B 3/30 (2013.01); B32B 5/26 (2013.01); B64F 5/60 (2017.01); G01N 29/043 (2013.01); B29C 2037/90 (2013.01); B29C 2793/0018 (2013.01); B29C 2793/0081 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/40 (2013.01); B32B 2307/732 (2013.01); B32B 2605/18 (2013.01); G01N 2033/0003 (2013.01); G01N 2203/0091 (2013.01); G01N 2291/0231 (2013.01); G01N 2291/0289 (2013.01);
Abstract

The invention relates to a method for producing a fiber-plastic composite reference body for simulating delamination for the nondestructive testing of FPC components, in particular aircraft components, comprising the following steps: i. producing a first insert by a. arranging a first FPC layer; b. forming a recess in the first FPC layer; c. procuring the first FPC layer, in order to obtain the first insert; ii. producing a second insert by a. arranging a second FPC layer; b. pre-curing the second FPC layer, in order to obtain the second insert; iii. providing at least one first FPC layer and at least one second FPC layer with a first clearance and a second clearance; iv. inserting the first insert and the second insert into the respective clearance of the corresponding FPC layer; v. curing the arrangement, a delamination being simulated at the recess of the first insert.


Find Patent Forward Citations

Loading…