The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Mar. 07, 2022
Applicants:
Takashi Kasai, Kyoto, JP;
Koji Momotani, Kyoto, JP;
Inventors:
Takashi Kasai, Kyoto, JP;
Koji Momotani, Kyoto, JP;
Assignee:
MMI SEMICONDUCTOR CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01K 13/02 (2021.01); G01N 25/18 (2006.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); G01K 13/02 (2013.01); H01L 23/00 (2013.01);
Abstract
The thermal sensor chip includes a substrate in which a cavity having an opening is formed, a membrane provided on a surface of the substrate so as to cover the opening, and a heater provided on or inside the membrane, wherein the heater includes wires in a mesh form constituted by a conductive member.