logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11971219 B1

PDFFull Text
Date of Patent:
Apr. 30, 2024

Filed:

Mar. 15, 2022

Heat dissipation device

Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Li-Kuang Tan, Taoyuan Hsien, TW;

Shih-Kang Lin, Taoyuan, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Ljiljana V Ciric

Int. Cl.
CPC ...
F28D 15/02 (2006.01); F21V 29/74 (2015.01); F21Y 115/10 (2016.01); F28D 15/04 (2006.01); F28D 21/00 (2006.01); F28F 3/06 (2006.01); F28F 9/007 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F28D 15/0233 (2013.01); F28D 15/04 (2013.01); F28F 3/06 (2013.01); H01L 23/427 (2013.01); H01L 33/64 (2013.01); F21V 29/74 (2015.01); F21Y 2115/10 (2016.08); F28D 2021/0028 (2013.01); F28F 9/0075 (2013.01); F28F 2275/08 (2013.01); H01L 23/3672 (2013.01);
Abstract

A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.

Find Patent Forward Citations

Tan, Li-Kuang. (2024). Heat dissipation device (U.S. Patent No. 11971219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11971219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…