The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jun. 01, 2021
Applicant:

Halliburton Energy Services, Inc., Houston, TX (US);

Inventors:

Yao Ge, Singapore, SG;

Ho Yin Ma, Singapore, SG;

Ruijia Wang, Singapore, SG;

Jing Jin, Singapore, SG;

Brenno Caetano Troca Cabella, Rio de Janeiro, BZ;

Xiang Wu, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/46 (2006.01); E21B 47/002 (2012.01); E21B 47/005 (2012.01); E21B 47/007 (2012.01); E21B 47/085 (2012.01); E21B 47/14 (2006.01); G01V 1/00 (2006.01); G01V 1/30 (2006.01);
U.S. Cl.
CPC ...
E21B 47/005 (2020.05); E21B 47/0025 (2020.05); E21B 47/007 (2020.05); E21B 47/085 (2020.05); E21B 47/14 (2013.01); G01V 1/001 (2013.01); G01V 1/30 (2013.01); G01V 2200/16 (2013.01);
Abstract

A method and system for identifying bonding between a material and tubing. The method may include disposing an acoustic logging tool in a wellbore, wherein the acoustic logging tool comprises a transmitter, a receiver, or a transceiver, broadcasting a shaped signal with the transmitter such that the shaped signal interacts with a boundary of a casing and a material and recording a result signal from the boundary with the receiver. The method may further comprise identifying a cut-off time to be applied to the result signal, transforming the result signal from a time domain to a frequency domain, selecting one or more modes sensitive to a bonding at the boundary between the casing and the material, computing a decay rate of the one or more modes that were selected based at least one or more decay curves, and converting the decay rate to a bonding log.


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