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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11970771 B1

PDFFull Text
Date of Patent:
Apr. 30, 2024

Filed:

Mar. 08, 2022

Vaporizer, substrate processing apparatus and method for manufacturing semiconductor device

Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Atsushi Morikawa, Toyama, JP;

Masakazu Shimada, Toyama, JP;

Takeshi Kasai, Toyama, JP;

Kenichi Suzaki, Toyama, JP;

Hirohisa Yamazaki, Toyama, JP;

Yoshimasa Nagatomi, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Jeffrie R Lund

Int. Cl.
CPC ...
C23C 16/448 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4486 (2013.01); C23C 16/405 (2013.01); C23C 16/4481 (2013.01); C23C 16/45544 (2013.01); C23C 16/45561 (2013.01); C23C 16/45563 (2013.01); C23C 16/45578 (2013.01); C23C 16/4587 (2013.01); H01L 21/02189 (2013.01); H01L 21/0228 (2013.01); H01L 21/67017 (2013.01); H01L 21/67098 (2013.01);
Abstract

A vaporization system includes a vaporization chamber having a first portion and a second portion. A first fluid supply part is connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and a liquid precursor are mixed, toward the second portion. A second fluid supply part is configured to supply a second carrier gas toward the mixed fluid at the second portion.

Find Patent Forward Citations

Morikawa, Atsushi. (2024). Vaporizer, substrate processing apparatus and method for manufacturing semiconductor device (U.S. Patent No. 11970771). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11970771

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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