The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Feb. 10, 2020
Applicant:

Young Chang Chemical Co., Ltd, Gyeongsangbuk-do, KR;

Inventors:

Seung Hun Lee, Daegu, KR;

Seung Hyun Lee, Daegu, KR;

Seong Hwan Kim, Daegu, KR;

Seung Oh Jin, Daegu, KR;

Assignee:

YOUNG CHANG CHEMICAL CO., LTD, Gyeongsangbuk-do, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C11D 1/72 (2006.01); B08B 3/08 (2006.01); B08B 3/12 (2006.01); C11D 3/04 (2006.01); C11D 3/20 (2006.01); C11D 3/43 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 1/72 (2013.01); B08B 3/08 (2013.01); B08B 3/12 (2013.01); C11D 3/042 (2013.01); C11D 3/2082 (2013.01); C11D 3/2086 (2013.01); C11D 3/43 (2013.01); H01L 21/02052 (2013.01); C11D 2111/22 (2024.01);
Abstract

A semiconductor wafer cleaning composition for used in a semiconductor device manufacturing process and a method of cleaning a semiconductor wafer using the cleaning composition are provided. The cleaning composition includes surfactants represented by Formula 1 and Formula 2, respectively, an organic or inorganic acid, and water occupying for the remaining proportion. The cleaning method is a method of immersing a semiconductor wafer in the cleaning composition for 100 to 500 seconds. The cleaning composition and the cleaning method according to the present disclosure provide an incredibility improved removal rate and an effective cleaning power for contaminants, especially organic wax, during a process of polishing the surface of a wafer used to manufacture semiconductor devices, thereby providing a super-cleaned wafer surface, resulting in production of reliable semiconductor devices.


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