The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Oct. 29, 2019
Applicant:

Delo Industrie Klebstoffe Gmbh & Co. Kgaa, Windach, DE;

Inventors:

Markus True, Windach, DE;

Markus Ehret, Windach, DE;

Bastian Sü-Veges, Windach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08G 65/336 (2006.01); C08G 77/08 (2006.01); C08G 77/18 (2006.01); C08K 5/053 (2006.01); C08K 5/07 (2006.01); C08K 5/09 (2006.01); C08K 5/5397 (2006.01); C09J 183/06 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); C08G 65/336 (2013.01); C08G 77/08 (2013.01); C08G 77/18 (2013.01); C08K 5/053 (2013.01); C08K 5/07 (2013.01); C08K 5/09 (2013.01); C08K 5/5397 (2013.01); C08G 2170/00 (2013.01); C08G 2190/00 (2013.01);
Abstract

A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture. Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.


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