The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Feb. 26, 2019
Tokyo Institute of Technology, Tokyo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Toshihiro Isobe, Tokyo, JP;
Yuko Hayakawa, Tokyo, JP;
Yuri Adachi, Tokyo, JP;
Ryosuke Uehara, Tokyo, JP;
TOKYO INSTITUTE OF TECHNOLOGY, Tokyo, JP;
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Abstract
A negative thermal expansion material having a negative thermal expansion coefficient according to the present invention is represented by ZrMSPO, where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd, and Cr; a is 0≤a<2; x is 0.4≤x≤1; and δ is a value defined as to satisfy a charge neutral condition. The present invention makes it possible to provide a negative thermal expansion material, a composite material and a method for producing a negative thermal expansion material that can realize reduction in cost and density reduction.