The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Feb. 22, 2022
Canon Kabushiki Kaisha, Tokyo, JP;
Takeshi Yamamoto, Kanagawa, JP;
Jun Miura, Kanagawa, JP;
Keiji Miyazaki, Tokyo, JP;
Hiroki Tanaka, Kanagawa, JP;
Makoto Fukatsu, Shizuoka, JP;
Akihisa Matsukawa, Tokyo, JP;
Takayuki Kanazawa, Kanagawa, JP;
Keigo Mizusawa, Kanagawa, JP;
Masanori Seki, Kanagawa, JP;
Masanori Tanaka, Kanagawa, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
The present disclosure provides a method for producing a microchannel device, which can form a channel that has high hydrophobicity, high solvent resistance as well, and also resistance to heat and damage, on demand with high accuracy, and produces the microchannel device at a low cost, while having high productivity. The method for producing a microchannel device includes: forming a channel pattern from a hydrophobic resin on a porous substrate by an electrophotographic method; melting the channel pattern by heat to allow the channel pattern to permeate into the porous substrate, thereby forming a channel in the inside of the porous substrate.