The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Nov. 06, 2019
Omron Corporation, Kyoto, JP;
Yusuke Nakayama, Kameoka, JP;
Daisuke Inoue, Ayabe, JP;
Yuki Ushiro, Ayabe, JP;
Takaaki Sanda, Fukuchiyama, JP;
Hiroto Katsura, Fukuchiyama, JP;
OMRON Corporation, Kyoto, JP;
Abstract
Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.