The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

May. 19, 2021
Applicant:

SK Hynix Inc., Icheon, KR;

Inventor:

Jun Ku Ahn, Icheon, KR;

Assignee:

SK hynix Inc., Icheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 63/00 (2023.01); C23C 14/06 (2006.01); C23C 14/34 (2006.01); H10N 70/00 (2023.01);
U.S. Cl.
CPC ...
H10N 70/026 (2023.02); C23C 14/0623 (2013.01); C23C 14/3414 (2013.01); H10B 63/00 (2023.02); H10N 70/8828 (2023.02);
Abstract

A sputtering target and a method for fabricating an electronic device using the same are provided. A sputtering target may include a carbon-doped GeSbTe alloy, wherein, for the carbon-doped GeSbTe alloy, an average grain diameter of a GeSbTe alloy after sintering is in a range of 0.5 μm to 5 μm, and a first ratio of an average grain diameter of carbon after the sintering is Y (μm) to the average grain diameter of the GeSbTe alloy after the sintering may be in a range of greater than 0.5 and equal to or less than 1.5. Alternatively, for the carbon-doped GeSbTe alloy, a condition of Y=X×(Z/100) may be satisfied, where an average grain diameter of a GeSbTe alloy after sintering is X (μm), an average grain diameter of carbon after the sintering is Y (μm), and a content of carbon is Z (at %).


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