The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Sep. 02, 2021
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventor:

Tatsuya Hinoue, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 41/27 (2023.01); H01L 29/792 (2006.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); H01L 29/7926 (2013.01); H10B 43/27 (2023.02);
Abstract

An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. The sacrificial material layers include a stack of word-line-level sacrificial material layers and at least one drain-select-level sacrificial material layer. Drain-select-level openings are formed through the at least one drain-select-level sacrificial material layer, which is replaced with at least one drain-select-level electrically conductive layer. Memory openings are formed by vertically extending the drain-select-level openings through the word-line-level sacrificial material layers. Memory opening fill structures are formed within the memory openings. The word-line-level sacrificial material layers are replaced with word-line-level electrically conductive layers.


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