The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Apr. 12, 2023
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Laurie Man Sum Kwan, San Francisco, CA (US);

Cindy Ngoc-Tran Au, Milpitas, CA (US);

Timothy Michael Vanderet, Berkeley, CA (US);

Cheng-jung Lee, San Jose, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); F16M 11/04 (2006.01); F16M 11/14 (2006.01); F16M 13/02 (2006.01); G03B 17/56 (2021.01); G08B 13/196 (2006.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1417 (2013.01); F16M 11/041 (2013.01); F16M 11/14 (2013.01); F16M 13/02 (2013.01); F16M 13/022 (2013.01); F16M 13/027 (2013.01); G03B 17/561 (2013.01); G08B 13/19617 (2013.01); H01Q 1/24 (2013.01); H01Q 9/0407 (2013.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 7/2039 (2013.01); G08B 13/19654 (2013.01);
Abstract

The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.


Find Patent Forward Citations

Loading…