The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Mar. 04, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jongwon Park, Suwon-si, KR;

Jaegeun Son, Suwon-si, KR;

Jaechan Lee, Suwon-si, KR;

Sunil Jin, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01R 12/52 (2011.01); H01R 12/57 (2011.01); H01R 12/70 (2011.01); H01R 31/06 (2006.01); H05K 1/11 (2006.01); H01R 12/72 (2011.01); H01R 12/75 (2011.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01R 12/52 (2013.01); H01R 12/57 (2013.01); H01R 12/7082 (2013.01); H01R 31/06 (2013.01); H05K 1/111 (2013.01); H01R 12/721 (2013.01); H01R 12/75 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.


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