The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Jun. 02, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kyle Indukummar Giesen, Lagrangeville, NY (US);

Sarah K. Czaplewski-Campbell, Rochester, MN (US);

Roger S. Krabbenhoft, Rochester, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/429 (2013.01); H05K 2201/029 (2013.01);
Abstract

An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.


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