The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Jul. 29, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sunggil Kim, Yongin-si, KR;

Jung-Hwan Kim, Seoul, KR;

Gukhyon Yon, Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 41/40 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H01L 29/42344 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 29/42328 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/40 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02);
Abstract

Disclosed is a semiconductor device comprising gate stack structures on a substrate, separation structures extending in a first direction on the substrate and separating the gate stack structures, and vertical structures penetrating the gate stack structures. Each gate stack structure includes cell dielectric layers and electrodes including upper electrodes, a barrier layer extending between the electrodes and the cell dielectric layers, a separation dielectric pattern extending in the first direction and penetrating the upper electrodes to separate each upper electrode into pieces that are spaced apart from each other in a second direction intersecting the first direction, and capping patterns between the separation dielectric pattern and the upper electrodes. The capping patterns are on sidewalls of each upper electrode and spaced apart from each other in a third direction perpendicular to a top surface of the substrate. Each capping pattern is on a sidewall of the barrier layer.


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