The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Feb. 25, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventor:

Kouta Tomita, Nonoichi Ishikawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/0214 (2013.01);
Abstract

A semiconductor device of embodiments includes: a semiconductor layer; a first insulating layer provided on the semiconductor layer; a first metal layer provided on the first insulating layer and containing aluminum (Al); a second metal layer provided on the first insulating layer and containing aluminum (Al); and a second insulating layer provided on the first insulating layer, provided between the first metal layer and the second metal layer, having a top surface in contact with a side surface of the first metal layer and a side surface of the second metal layer, and containing silicon (Si) and nitrogen (N).


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