The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Jan. 27, 2021
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Aiko Kaji, Kariya, JP;
Haruhito Ichikawa, Kariya, JP;
Shuhei Mitani, Kariya, JP;
Tomohiro Mimura, Kariya, JP;
Yukihiro Wakasugi, Toyota, JP;
Narumasa Soejima, Nagakute, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/04 (2006.01); H01L 29/16 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/0485 (2013.01); H01L 29/1608 (2013.01); H01L 29/45 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A method for manufacturing a semiconductor device includes: forming an insulating film on a surface of a semiconductor layer of a semiconductor substrate; forming a contact hole in the insulating film; forming a conductor material on the insulating film to be in contact with the semiconductor layer through the contact hole; and patterning the conductor material using an alignment key included in the conductor material.