The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Jun. 28, 2021
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Hiroki Sato, Tsukuba, JP;

Yuusuke Ohshima, Tsukuba, JP;

Shigeyuki Ootake, Tsukuba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 5/12 (2006.01); B22F 1/054 (2022.01); B22F 1/107 (2022.01); B22F 3/10 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/056 (2022.01); B22F 1/107 (2022.01); B22F 3/10 (2013.01); B22F 5/12 (2013.01); B22F 2003/1042 (2013.01); B22F 2301/255 (2013.01); B22F 2304/056 (2013.01);
Abstract

The present invention relates to a metal wiring, to be formed on a flexible substrate, including a sintered body of silver particles. The sintered body constituting the metal wiring has a volume resistivity of 20 μΩ·cm or less, hardness of 0.38 GPa or less, and a Young's modulus of 7.0 GPa or less. A conductive sheet provided with the metal wiring can be produced by applying/calcinating, on a substrate, a metal paste containing, as a solid content, silver particles having prescribed particle size and particle size distribution, and further containing, as a conditioner, an ethyl cellulose having a number average molecular weight of 10,000 or more and 90,000 or less. The metal wiring of the present invention is excellent in bending resistance with change in electrical characteristics suppressed even through repetitive bending deformation.


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