The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Jan. 29, 2021
Applicant:
Sony Group Corporation, Tokyo, JP;
Inventors:
Tetsuro Goto, Tokyo, JP;
Ken Kobayashi, Tokyo, JP;
Kei Tsukamoto, Tokyo, JP;
Tomoko Katsuhara, Tokyo, JP;
Assignee:
Sony Group Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0446 (2019.05); G06F 3/0414 (2013.01); G06F 3/0445 (2019.05); G06F 3/0447 (2019.05); G06F 2203/04102 (2013.01); G06F 2203/04106 (2013.01);
Abstract
A sensor module includes a sensor that includes a first sensor layer of a capacitance type including a plurality of first detection units arranged two-dimensionally and a second sensor layer of a capacitance type including a plurality of second detection units arranged two-dimensionally, the first sensor layer being provided on the second sensor layer, and a control unit that scans the plurality of first detection units and the plurality of second detection units.