The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Sep. 30, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Jon R. Dory, Spring, TX (US);

Matthew Flach, Fort Collins, CO (US);

David H. Hanes, Fort Collins, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); A61F 7/00 (2006.01); G06F 3/01 (2006.01); H04R 1/10 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); A61F 7/00 (2013.01); G06F 3/011 (2013.01); H04R 1/1091 (2013.01); A61F 2007/0002 (2013.01); G02B 27/0176 (2013.01); H04R 1/1008 (2013.01);
Abstract

In one example in accordance with the present disclosure, a headset is described. The headset includes a sensory input device and a pad surrounding the sensory input device. The pad includes a thermo-electric cooling (TEC) device having a first side and a second side. The first side is to cool and the second side is to heat when a voltage is applied to the TEC device. The pad also includes a cooling layer in contact with the first side of the TEC device and a heat spreading layer in contact with the second side of the TEC device. The pad also includes an enclosing material enveloping the pad.


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