The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Jul. 24, 2019
Applicant:

Fluke Corporation, Everett, WA (US);

Inventors:

Michael D. Stuart, Issaquah, WA (US);

Dileepa Prabhakar, Edmonds, WA (US);

Assignee:

Fluke Corporation, Everett, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 15/89 (2006.01); G01C 3/02 (2006.01); G01C 21/16 (2006.01); G01H 3/12 (2006.01); G01S 3/808 (2006.01); G01S 7/56 (2006.01); G01S 15/86 (2020.01); G01S 17/86 (2020.01); G01S 19/01 (2010.01); G06T 7/70 (2017.01); G06T 11/00 (2006.01); H04N 23/80 (2023.01); H04R 29/00 (2006.01); H04S 7/00 (2006.01);
U.S. Cl.
CPC ...
G01S 15/8977 (2013.01); G01C 3/02 (2013.01); G01C 21/16 (2013.01); G01H 3/125 (2013.01); G01S 3/808 (2013.01); G01S 3/8086 (2013.01); G01S 7/56 (2013.01); G01S 15/86 (2020.01); G01S 15/89 (2013.01); G01S 17/86 (2020.01); G01S 19/01 (2013.01); G06T 7/70 (2017.01); G06T 11/00 (2013.01); H04N 23/80 (2023.01); H04R 29/008 (2013.01); H04S 7/301 (2013.01); H04S 7/40 (2013.01); G06T 2207/10012 (2013.01); H04R 2430/20 (2013.01);
Abstract

Some systems include an electromagnetic imaging tool configured to receive electromagnetic radiation, a communication interface, a processor in communication with the electromagnetic imaging tool and the communication interface, and a housing. Systems can include a first sensor head having a first plurality of acoustic sensor elements arranged in a first acoustic sensor array. The communication interface can provide communication between the processor and the sensor head via wired or wireless communication. The communication interface can comprise a docking port in communication with the processor and configured to removably receive a corresponding docking mechanism of the first sensor head. Some systems may include a second sensor head having a second plurality of acoustic sensor elements. The second sensor head may be interchangeably connectable to the communication interface and/or the first sensor head.


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