The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Aug. 06, 2021
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yousuke Irie, Nara, JP;

Hirotsugu Inoue, Tokyo, JP;

Koutaro Sakamoto, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 3/06 (2006.01); G01B 21/08 (2006.01); G01J 5/00 (2022.01); G01N 25/72 (2006.01); G01K 3/04 (2006.01);
U.S. Cl.
CPC ...
G01B 21/085 (2013.01); G01J 5/0003 (2013.01); G01N 25/72 (2013.01); G01J 2005/0077 (2013.01); G01K 3/04 (2013.01); G01K 3/06 (2013.01);
Abstract

A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.


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