The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Aug. 06, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akira Yatsuyanagi, Tokyo, JP;

Tsuyoshi Maeda, Tokyo, JP;

Akira Ishibashi, Tokyo, JP;

Atsushi Morita, Tokyo, JP;

Shin Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 1/32 (2006.01); F28D 1/04 (2006.01);
U.S. Cl.
CPC ...
F28F 1/32 (2013.01); F28D 1/04 (2013.01); F28F 2210/08 (2013.01);
Abstract

In a heat exchanger, an outer diameter of a plurality of heat transfer pipes is defined as Do, a wall thickness is defined as tP, an area represented by a numerical expression of a row pitch L×a step pitch Lis defined as A, and an area represented by a numerical expression of ((Do−2×tP)/2)×π is defined as B, a relation of Do<5.5 mm, a relation of (0.2076×tP−0.1480×tP+0.0545)×Do{circumflex over ( )}(−0.0021×tP−0.0528×tP+0.0164)≤B/A≤(0.0219×tP−0.0185×tP+0.0043)×ln (Do)+(1.6950×tP+1.8455×tP+1.5416), and a relation of B/A<0.0076×tP−0.0417×tP+0.0574 are satisfied.


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