The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Dec. 08, 2020
Applicant:

Central South University, Changsha, CN;

Inventors:

Chengshang Zhou, Changsha, CN;

Yong Liu, Changsha, CN;

Zhongyuan Duan, Changsha, CN;

Assignee:

CENTRAL SOUTH UNIVERSITY, Changsha, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); F03G 7/06 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
F03G 7/0616 (2021.08); B32B 15/01 (2013.01); B32B 15/013 (2013.01); F03G 7/0613 (2021.08); F03G 7/062 (2021.08); B33Y 80/00 (2014.12); F05C 2253/04 (2013.01);
Abstract

An adjustable deforming composite structure based on a hydrogen-induced expansion effect and a preparation method therefor are provided. The hydrogen-induced expansion effect means metals absorb hydrogen under a hydrogen-containing atmosphere and at a temperature to produce a volume expansion effect. Reactions between the metals and hydrogen are reversible reactions. When a hydrogen partial pressure is reduced or the temperature is increased, the hydrogen in the metals is removed, and the metals are restored to an original shape. Under a stimulation of external hydrogen and heat, a composite of a hydrogen-absorbing metal and other non-hydrogen-absorbing materials undergo an adjustable deformation according to a design, and a material undergoes reversible shape changes. The preparation method is applied to composite materials for a 4D printing and is used for an intelligent shape adjustment at a medium to high temperature.


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