The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Feb. 10, 2020
Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Kerstin Klingeberg, Hamburg, DE;

Lars Guldbrandsen, Barsbüttel, DE;

Nadine Wedel, Hamburg, DE;

Heike Simonis, Hamburg, DE;

Christian Schuh, Hamburg, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 7/25 (2018.01); C09J 153/00 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01); D06M 15/55 (2006.01); D06M 23/00 (2006.01); H01B 3/40 (2006.01); H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 13/012 (2006.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); C09J 7/255 (2018.01); C09J 153/00 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); D06M 15/55 (2013.01); D06M 23/00 (2013.01); H01B 3/40 (2013.01); H01B 7/0045 (2013.01); H01B 7/0241 (2013.01); H01B 13/01209 (2013.01); H01B 13/01263 (2013.01); C09J 2203/302 (2013.01); C09J 2301/414 (2020.08); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); Y10T 428/2809 (2015.01); Y10T 428/287 (2015.01); Y10T 428/2891 (2015.01);
Abstract

The present disclosure relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape comprises a tapelike carrier provided on at least one side with an adhesive layer which consists of a self-adhesive, pressure-sensitive adhesive, characterized in that the self-adhesive pressure-sensitive adhesive is a UV-curable composition comprising, based on the total weight of the composition: 15 to 50 parts by weight of matrix polymer; 50 to 85 parts by weight of epoxy resin; 0.1 to 3 parts by weight of photoinitiator, with the matrix polymer forming a self-supporting film in which epoxy resin and photoinitiator are embedded.


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