The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Nov. 23, 2021
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Yoshito Tanaka, Osaka, JP;

Tomohiro Yoshida, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/30 (2006.01); B32B 27/38 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); H05K 1/03 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/308 (2013.01); C08G 59/245 (2013.01); C08G 59/5073 (2013.01); H05K 1/034 (2013.01);
Abstract

A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being: the formula (E1) being: the formula (E2) being: the formula (E3) being: Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.


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