The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

May. 18, 2023
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Xiaojiang Wang, Saline, MI (US);

Shannon Christine Bollin, South Lyon, MI (US);

Robert D. Bedard, Allen Park, MI (US);

Matthew Cassoli, Southgate, MI (US);

Ellen Cheng-Chi Lee, Ann Arbor, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 220/18 (2006.01); B29C 64/129 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08F 2/48 (2006.01); C08F 216/12 (2006.01); C08F 222/10 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); C23C 18/50 (2006.01);
U.S. Cl.
CPC ...
C08F 220/1808 (2020.02); C08F 2/48 (2013.01); C08F 216/125 (2013.01); C08F 220/1804 (2020.02); C08F 222/102 (2020.02); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/2013 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/50 (2013.01); B29C 64/129 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12);
Abstract

A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.


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