The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Oct. 29, 2019
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Dong Cui, Beijing, CN;

Rui Han, Beijing, CN;

Qing Ma, Beijing, CN;

Zeyuan Tong, Beijing, CN;

Zhipeng Zhang, Beijing, CN;

Fengping Wang, Beijing, CN;

Yue Zhai, Beijing, CN;

Zan Zhang, Beijing, CN;

Wenyang Li, Beijing, CN;

Weining Chi, Beijing, CN;

Rui Tan, Beijing, CN;

Shouyang Leng, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/14 (2006.01); B32B 37/12 (2006.01); B60K 35/00 (2006.01); B60K 35/22 (2024.01);
U.S. Cl.
CPC ...
B32B 7/14 (2013.01); B32B 37/12 (2013.01); B60K 35/00 (2013.01); B32B 2307/42 (2013.01); B32B 2405/00 (2013.01); B32B 2457/202 (2013.01); B32B 2605/00 (2013.01); B60K 35/22 (2024.01); B60K 2360/1523 (2024.01); B60K 2360/25 (2024.01);
Abstract

A tape includes: a substrate, a conductive adhesive layer disposed on the substrate, and an insulating layer disposed on a part of a bonding surface of the conductive adhesive layer. The insulating layer is configured to insulate the conductive adhesive layer from a conducting part of an object to be bonded.


Find Patent Forward Citations

Loading…