The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Aug. 31, 2021
Inventec (Pudong) Technology Corp., Shanghai, CN;
Inventec Corporation, Taipei, TW;
Wen-Ching Lin, Taipei, TW;
Ting-Yu Wang, Taipei, TW;
Fa-Chih Ke, Taipei, TW;
Yu-Ling Lin, Taipei, TW;
Wen-Hsiang Chen, Taipei, TW;
Inventec (Pudong) Technology Corp., Shanghai, CN;
Inventec Corporation, Taipei, TW;
Abstract
A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.