The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2024

Filed:

Feb. 28, 2017
Applicant:

Osaka University, Suita, JP;

Inventors:

Hidetoshi Fujii, Suita, JP;

Rintaro Ueji, Suita, JP;

Yoshiaki Morisada, Suita, JP;

Assignee:

OSAKA UNIVERSITY, Suita, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/12 (2006.01); B23K 20/227 (2006.01); B23K 20/233 (2006.01); B23K 103/02 (2006.01); B23K 103/10 (2006.01);
U.S. Cl.
CPC ...
B23K 20/1235 (2013.01); B23K 20/1225 (2013.01); B23K 20/123 (2013.01); B23K 20/125 (2013.01); B23K 20/227 (2013.01); B23K 20/2336 (2013.01); B23K 2103/02 (2018.08); B23K 2103/10 (2018.08);
Abstract

A low-temperature joining method effectively suppresses reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and produces a joint structure. A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint portion and plunge a rotation tool caused to rotate at a prescribed speed into the joint, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the recrystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the recrystallization temperature inherent to the metal materials.


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