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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11963385 B1

PDFFull Text
Date of Patent:
Apr. 16, 2024

Filed:

Oct. 25, 2021

Local stretch package structure and manufacturing method thereof

Applicants:

Interface Technology (Chengdu) Co., Ltd., Sichuan, CN;

Interface Optoelectronics (Shenzhen) Co., Ltd., Guangdong, CN;

General Interface Solution Limited, Miaoli County, TW;

Inventors:

Wen-You Lai, Guangdong, CN;

Ping-Hsiang Kao, Guangdong, CN;

Po-Lun Chen, Guangdong, CN;

Chun-Ta Chen, Guangdong, CN;

Po-Ching Lin, Guangdong, CN;

Ya-Chu Hsu, Guangdong, CN;

Assignees:

Interface Technology (ChengDu) Co., Ltd., Sichuan, CN;

Interface Optoelectronics (ShenZhen) Co., Ltd., Guangdong, CN;

General Interface Solution Limited, Miaoli County, TW;

Attorney:

CKC & Partners Co., LLC

Primary Examiner:

Joe E Schoenholtz

Int. Cl.
CPC ...
H10K 50/844 (2023.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/52 (2010.01); H10K 59/90 (2023.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/844 (2023.02); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/52 (2013.01); H10K 59/90 (2023.02); H10K 71/00 (2023.02); H01L 2933/005 (2013.01); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

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