The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Mar. 16, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Kotaro Noda, Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 63/00 (2023.01); H01L 23/00 (2006.01); H10N 70/00 (2023.01);
U.S. Cl.
CPC ...
H10B 63/84 (2023.02); H01L 24/43 (2013.01); H01L 24/46 (2013.01); H10N 70/061 (2023.02); H10N 70/826 (2023.02); H10N 70/841 (2023.02);
Abstract

A certain embodiment includes: first wiring layers extended in a first direction and arranged in a second direction; second wiring layers provided above the first wiring layer of a third direction and arranged in the first direction and extended in the second direction; first stacked structures comprising a first memory cell disposed between the second and first wiring layers at a crossing portion between the second and first wiring layers; first conductive layers provided in the same layer as the first wiring layers, adjacent to the first wiring layer in the second direction, and not connected to other than the second wiring layer; second stacked structures disposed at crossing portions between the second wiring layers and the first conductive layers; and an insulation layer provided between the first stacked structures and between the second stacked structures having a Young's modulus larger than that of the insulation layer.


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