The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Mar. 30, 2021
International Business Machines Corporation, Armonk, NY (US);
Matthew Doyle, Chatfield, MN (US);
Thomas W. Liang, Rochester, MN (US);
Layne A. Berge, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
Jason J. Bjorgaard, Rochester, MN (US);
Kyle Schoneck, Rochester, MN (US);
Matthew A. Walther, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.