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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11963297 B1

PDFFull Text
Date of Patent:
Apr. 16, 2024

Filed:

Dec. 24, 2019

Fluororesin composition, fluororesin sheet, laminate and substrate for circuits

Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Hirokazu Komori, Osaka, JP;

Hiroyuki Yoshimoto, Osaka, JP;

Masaji Komori, Osaka, JP;

Yuki Ueda, Osaka, JP;

Junpei Terada, Osaka, JP;

Assignee:

DAIKIN INDUSTRIES, LTD., Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Camie S Thompson

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 5/02 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); B32B 17/10 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); C08F 214/26 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 17/10 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/322 (2013.01); C08F 214/262 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); C08F 2800/10 (2013.01); C08J 2327/18 (2013.01); H05K 2201/015 (2013.01);
Abstract

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

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