The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Aug. 16, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 1/04 (2006.01); H04R 1/08 (2006.01); H04R 3/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/023 (2013.01); H04R 1/025 (2013.01); H04R 1/04 (2013.01); H04R 1/086 (2013.01); H04R 3/00 (2013.01); H04R 2201/029 (2013.01); H04R 2400/11 (2013.01); H04R 2499/11 (2013.01);
Abstract
A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.