The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Jul. 10, 2019
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Hiroyuki Hagino, Osaka, JP;

Shinichiro Nozaki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/02 (2006.01); H01S 5/0237 (2021.01); H01S 5/0239 (2021.01); H01S 5/14 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 5/0207 (2013.01); H01S 5/0237 (2021.01); H01S 5/0239 (2021.01); H01S 5/02461 (2013.01); H01S 5/141 (2013.01); H01S 5/4087 (2013.01); H01S 5/40 (2013.01); H01S 5/4062 (2013.01);
Abstract

A semiconductor light emitting device includes: a semiconductor light emitting element including a substrate and a plurality of light emitters arranged along an upper surface of the substrate; a first base disposed below a lower surface of the substrate; and a first bonding layer which bonds the semiconductor light emitting element to the first base. In the semiconductor light emitting device, a thermal conductivity of the substrate is higher than a thermal conductivity of the first bonding layer, and a thickness of the first bonding layer is less on one end side than on an other end side in an arrangement direction in which the plurality of light emitters are arranged.


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