The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Jan. 28, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hideki Hata, Chino, JP;

Masaki Miyasaka, Chino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H01R 12/77 (2011.01); H02K 5/22 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/774 (2013.01); H02K 5/225 (2013.01); H01R 2201/10 (2013.01);
Abstract

A coupling method of coupling a flexible flat cable to a connector by a robot, includes a preparation step of preparing the connector having an insertion hole into which the flat cable is inserted and a seat having an introduction surface placed at a front side of the insertion hole and continuously coupled to the insertion hole, a first moving step of gripping the flat cable and moving the flat cable to a position facing the seat; and a pressing step of bringing the flat cable into contact with the introduction surface in a posture inclined relative to the seat with an end of the flat cable facing the insertion hole side and pressing the flat cable against the introduction surface, and moving the end toward the connector side.


Find Patent Forward Citations

Hata, Hideki. (2024). Coupling method and robot system (U.S. Patent No. 11962105). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11962105

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…