The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Feb. 24, 2022
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Seokwoo Lee, Gyeonggi-do, KR;

Yeonghun Gu, Gyeonggi-do, KR;

Youngho Park, Gyeonggi-do, KR;

Jiwoo Lee, Gyeonggi-do, KR;

Kio Jung, Gyeonggi-do, KR;

Ko Choi, Gyeonggi-do, KR;

Woojin Choi, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H04M 1/02 (2006.01); H04M 1/72454 (2021.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/245 (2013.01); H01Q 1/38 (2013.01); H04M 1/0277 (2013.01); H04M 1/72454 (2021.01);
Abstract

An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.


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