The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Aug. 13, 2021
Applicant:

Lapis Semiconductor Co., Ltd., Yokohama, JP;

Inventor:

Hiroshi Shibata, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/92 (2006.01); H01L 29/66 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
H01L 29/945 (2013.01); H01L 29/66181 (2013.01);
Abstract

A semiconductor device has a semiconductor substrate and a semiconductor film doped with impurities that is formed so as to cover an inner wall surface of a trench formed so as to extend from a first surface of the semiconductor substrate towards an interior thereof. The semiconductor film is formed so as to extend continuously from the inner wall surface to the first surface of the semiconductor substrate. The semiconductor device further has an opposite electrode having a first portion that is provided at a position opposing the semiconductor substrate while sandwiching the semiconductor film therebetween, and that extends on the first surface of the semiconductor substrate, and a second portion that is continuous with the first portion and extends so as to fill the trench. The semiconductor device further has an insulating film that insulates the semiconductor film from the opposite electrode.


Find Patent Forward Citations

Loading…