The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Sep. 14, 2021
Applicant:

Honeywell Federal Manufacturing & Technologies, Llc, Kansas City, MO (US);

Inventors:

Erik Joseph Timpson, Lee's Summit, MO (US);

Justin M. Schlitzer, Stillwell, KS (US);

Thomas Matthew Selter, Blue Springs, MO (US);

Michael Walsh, Overland Park, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/84 (2006.01); H01L 29/868 (2006.01);
U.S. Cl.
CPC ...
H01L 29/51 (2013.01); H01L 29/4916 (2013.01); H01L 29/84 (2013.01); H01L 29/868 (2013.01);
Abstract

Systems and methods for building passive and active electronics with diamond-like carbon (DLC) coatings are provided herein. DLC may be layered upon substrates to form various components of electronic devices. Passive components such as resistors, capacitors, and inductors may be built using DLC as a dielectric or as an insulating layer. Active components such as diodes and transistors may be built with the DLC acting substantially like a semiconductor. The amount of spand spbonded carbon atoms may be varied to modify the properties of the DLC for various electronic components.


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