The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Feb. 16, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yoshihito Otsubo, Nagaokakyo, JP;
Motohiko Kusunoki, Nagaokakyo, JP;
Takanori Uejima, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/552 (2013.01); H01L 23/49822 (2013.01);
Abstract
A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.
Otsubo, Yoshihito. (2024). Module (U.S. Patent No. 11961830). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11961830
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile