The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Feb. 17, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Changeun Joo, Cheonan-si, KR;
Gyujin Choi, Anyang-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/3135 (2013.01); H01L 23/5384 (2013.01); H01L 24/13 (2013.01); H01L 2224/13008 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13023 (2013.01);
Abstract
A semiconductor package includes a lower redistribution layer including an insulating pattern having an opening and a via in the opening; a first semiconductor chip including a chip pad, a passivation layer, and a pad bump connected to the chip pad; and a first encapsulant on the lower redistribution layer and the first semiconductor chip. The opening defines a lower surface and a side surface of the pad bump, and the via is in physical contact with the lower surface and the side surface of the pad bump.