The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Feb. 07, 2020
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Hitoshi Okano, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
To provide a semiconductor apparatus that makes it possible to further improve the efficiency in heat dissipation, and to provide an electronic apparatus that includes the semiconductor apparatus. A semiconductor apparatus is provided that includes a substrate, a plurality of chips each stacked on the substrate, and a plurality of guard rings each formed on an outer peripheral portion of a corresponding one of the plurality of chips to surround the corresponding one of the plurality of chips, in which at least portions of at least two of the plurality of guard rings are connected to each other through a thermally conductive material. Further, an electric apparatus is provided that includes the semiconductor apparatus.