The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Feb. 03, 2022
International Business Machines Corporation, Armonk, NY (US);
Brent A. Anderson, Jericho, VT (US);
Lawrence A. Clevenger, Saratoga Springs, NY (US);
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Christopher J. Penny, Saratoga Springs, NY (US);
Kisik Choi, Watervliet, NY (US);
Robert Robison, Rexford, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
An interconnect structure for an integrated circuit includes a plurality of first-type interconnect elements and a second-type of interconnect element which directly contact an underlying first-type interconnect element. The second-type interconnect element extends along a first axis to define a horizontal length and along a second axis to define a vertical height. The second-type interconnect element and the first-type interconnect element define a conductive via comprising a metal material extending continuously along the second axis from a base of the underlying first-type interconnect element and stopping at the upper surface of the second-type interconnect element. The vertical height of the second-type interconnect element is greater than the vertical height of the first-type interconnect elements.